2011•Equipment for Electronic Products ManufacturingRequires access
The Effect Analyzes of the Plate and the Head Rotation Speed Ratio in The Chemical Mechanical Polishing process
Fei Jiuhai
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Abstract
In the Chemical Mechanical Polishing(CMP) process,the rotation speed ratio of the polishing plate and the polishing head is different,the wafer's surface planarization state is also different.This article analyzes the moving speed and the moving track of the random dot on the wafer surface by the kinematics theory.Using the Matlab simulation method finds the relations between the rotation speed ratio and the moving speed,the moving track.