2003•Manufacturing Technology & Machine ToolRequires access

Motion Analysis of IntelligentPolishing Machine at Nanometer Level

Ping Zhao

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Abstract

The motion design principle of the intelligent polishing machine at nanometerlevel has been analyzed, by having the equally spaced points on the machining surface of the workpiece relatively to the polishing line speed of the polishing disk, and the motion tracks of every point being not repeat, the motion mode of low-speed start-step less acceleration-constant speed polishing-low-speed trimming-low-speed stophas been proposed. Through using grating measurement and computer controlling technology, the accuracy of the total revolution of the polishing disk is controlled within (0.5(to ensure the removalerror of the polishing allowancewithin 1nm, and combining reasonable polishing technology, very good flatness and ultra-smooth surface without damage of the wafer can be obtained.

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What this paper is about

The motion design principle of the intelligent polishing machine at nanometerlevel has been analyzed, by having the equally spaced points on the machining surface of the workpiece relatively to the polishing line speed of the polishing disk, and the motion tracks of every point being not repeat, the motion mode of low-speed start-step less acceleration-constant speed polishing-low-speed trimming-low-speed stophas been proposed. Through using grating measurement and computer controlling technology, the accuracy of the total revolution of the polishing disk is controlled within (0.5(to ensure the removalerror of the polishing allowancewithin 1nm, and combining reasonable polishing technology, very good flatness and ultra-smooth surface without damage of the wafer can be obtained.

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Available abstract

The motion design principle of the intelligent polishing machine at nanometerlevel has been analyzed, by having the equally spaced points on the machining surface of the workpiece relatively to the polishing line speed of the polishing disk, and the motion tracks of every point being not repeat, the motion mode of low-speed start-step less acceleration-constant speed polishing-low-speed trimming-low-speed stophas been proposed. Through using grating measurement and computer controlling technology, the accuracy of the total revolution of the polishing disk is controlled within (0.5(to ensure the removalerror of the polishing allowancewithin 1nm, and combining reasonable polishing technology, very good flatness and ultra-smooth surface without damage of the wafer can be obtained.

Key concepts: Polishing, Machining, Trimming, Flatness (cosmology), Jerk, Acceleration, Wafer, Machine tool

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