2006•Equipment for Electronic Products ManufacturingRequires access

Press Technology of Solder Paste and Change of Process Parameter in Lead-free Technology

Shi Jian-wei

Abstract

With higher density assembly and smaller devices, fine pitch leader requires perfect solder printing quality. In order to ensure product quality and establish proper printing process windows, we discuss the printing technology of solder paste and setting of process parameter, and present relevant improvement measures.

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Available abstract

Key concepts: Soldering, Solder paste, Process (computing), Lead (geology), Process engineering, Quality (philosophy), Materials science, Product (mathematics)