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Modelling and computer simulation of the behaviour of solder paste in stencil printing for surface mount assembly

Dong He

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Available from British Library Document Supply Centre-DSC:DXN018843 / BLDSC - British Library Document Supply Centre

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Available from British Library Document Supply Centre-DSC:DXN018843 / BLDSC - British Library Document Supply Centre

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Available from British Library Document Supply Centre-DSC:DXN018843 / BLDSC - British Library Document Supply Centre

Key concepts: Solder paste, Soldering, Materials science, Surface-mount technology, Rheology, Flip chip, Stencil, Mechanical engineering

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Modelling and computer simulation of the behaviour of solder paste in stencil printing for surface mount assembly — Research Paper | ScholarLens