2003•Unpublished venueRequires access

Process Improvement for High Quality of Solder Paste Printing

Yang Xiao

Abstract

The quality of solder paste printing plays an important role in surface mount technology (SMT) The compositions of solder paste and its characteristics are analyzed in detail in the paper How to choose process parameters correctly is also discussed An analysis is made on problems often occurred in printing Causes of the problems are pointed out, and measures are proposed for improvement

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Key concepts: Solder paste, Surface-mount technology, Soldering, Process (computing), Quality (philosophy), Materials science, Process engineering, Manufacturing engineering