2006•Electronic Components and MaterialsRequires access

Research Progress of Lead-free Solders and Solder Joint Reliability in Electronic Packaging

Zhenzhong Zhang

Abstract

As RoHS law will be implemented on July 1,2006,the research and application of lead-free solders become a hot problem in the world.With the change of material and technics in electronic packaging,it brings the problem of solder joint reliability.Research progress of lead-free solder,invalidation models of solder joint,solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.The prospective research on directions of lead-free technology in the future are forecasted.

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Available abstract

Key concepts: Soldering, Joint (building), Reliability (semiconductor), Materials science, Lead (geology), Electronic packaging, Metallurgy, Reliability engineering