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2007•Journal of Civil Aviation University of ChinaRequires access

Research on Lead-Free Solder Joint Reliability

Hui Zou

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Abstract

Considering environmental protections and sustainable development,the use of Sn-Pb solder will be totally banned in electronic packaging in many country.So the research and application of lead-free solders is the major target of next generation solders.However,it brings the problem of lead-free solder joint reliability evaluation for the change of material and techniques.The failure of one soldered joint is frequently found to be the origin of the failure of the whole package.In this paper,the test methods of mechanics and the life prediction for solder joints were presented and discussed.

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What this paper is about

Considering environmental protections and sustainable development,the use of Sn-Pb solder will be totally banned in electronic packaging in many country.So the research and application of lead-free solders is the major target of next generation solders.However,it brings the problem of lead-free solder joint reliability evaluation for the change of material and techniques.The failure of one soldered joint is frequently found to be the origin of the failure of the whole package.In this paper,the test methods of mechanics and the life prediction for solder joints were presented and discussed.

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Available abstract

Considering environmental protections and sustainable development,the use of Sn-Pb solder will be totally banned in electronic packaging in many country.So the research and application of lead-free solders is the major target of next generation solders.However,it brings the problem of lead-free solder joint reliability evaluation for the change of material and techniques.The failure of one soldered joint is frequently found to be the origin of the failure of the whole package.In this paper,the test methods of mechanics and the life prediction for solder joints were presented and discussed.

Key concepts: Soldering, Joint (building), Reliability (semiconductor), Lead (geology), Reliability engineering, Electronic packaging, Forensic engineering, Mechanical engineering

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