2010•Electronics Process TechnologyRequires access

Progress and Review on Lead-free Solder Joint Reliability in Micro-electronic Packaging

Zhou Jie

Abstract

In the lead-free process of electrical and electronic equipment,solder joint reliability has become the increasingly outstanding problem because of the change of material and technology in electronic packaging.Three aspects,influencing factors on lead-free solder joint reliability,typical reliability problems and lead-free solder joint reliability evaluation are elaborated emphatically in detail,in order to demonstrate issues and tendency on lead-free and research on solder joint reliability.

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Key concepts: Soldering, Reliability (semiconductor), Joint (building), Lead (geology), Electronic packaging, Reliability engineering, Materials science, Engineering