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Study on the Shear Testing of Sn-Ag-Cu Solder Joint in Microelectronic Packaging

Fei Xiao

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Abstract

A new shear test method for solder joint in microelectronic packaging was proposed,by which the error of measurement can be effectively suppressed.With the new test method,Sn-Ag-Cu lead-free solder joints on Cu or Ni-P board for aging up to 1000 h were tested.Moreover,the microstructures of solder joints facture surface were studied.The results indicate that the new test-ing method has small error and it is easy to be implemented.The shear strength of joints and fracture location were related to the morphology and composition of the intermetallic compound(IMC).

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What this paper is about

A new shear test method for solder joint in microelectronic packaging was proposed,by which the error of measurement can be effectively suppressed.With the new test method,Sn-Ag-Cu lead-free solder joints on Cu or Ni-P board for aging up to 1000 h were tested.Moreover,the microstructures of solder joints facture surface were studied.The results indicate that the new test-ing method has small error and it is easy to be implemented.The shear strength of joints and fracture location were related to the morphology and composition of the intermetallic compound(IMC).

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Available abstract

A new shear test method for solder joint in microelectronic packaging was proposed,by which the error of measurement can be effectively suppressed.With the new test method,Sn-Ag-Cu lead-free solder joints on Cu or Ni-P board for aging up to 1000 h were tested.Moreover,the microstructures of solder joints facture surface were studied.The results indicate that the new test-ing method has small error and it is easy to be implemented.The shear strength of joints and fracture location were related to the morphology and composition of the intermetallic compound(IMC).

Key concepts: Soldering, Microelectronics, Intermetallic, Direct shear test, Materials science, Joint (building), Shear strength (soil), Metallurgy

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