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Simulation of magnetic field and structural design of rectangularly plane target cathode for magnetron sputtering

Zhang Jian-guo

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Abstract

The effects of structural parameters of target cathode on magnetic field distribution during magnetron sputtering were simulated and analyzed to design a new-type rectangularly plane cathode,then the magnetic field of the designed cathode was simulated and analysed.The results showed that the uniformity of magnetic field distribution on target surface is improved effectively.The interstitial magnetic field distribution between cathode assembly and anode frame is changed by mounting a plate of high magnetic conductivity onto the inner side of anode frame,thus solving the problem of the interstitially continuous discharge.This design provides a reference for the target cathode for magnetron sputtering.

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What this paper is about

The effects of structural parameters of target cathode on magnetic field distribution during magnetron sputtering were simulated and analyzed to design a new-type rectangularly plane cathode,then the magnetic field of the designed cathode was simulated and analysed.The results showed that the uniformity of magnetic field distribution on target surface is improved effectively.The interstitial magnetic field distribution between cathode assembly and anode frame is changed by mounting a plate of high magnetic conductivity onto the inner side of anode frame,thus solving the problem of the interstitially continuous discharge.This design provides a reference for the target cathode for magnetron sputtering.

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Available abstract

The effects of structural parameters of target cathode on magnetic field distribution during magnetron sputtering were simulated and analyzed to design a new-type rectangularly plane cathode,then the magnetic field of the designed cathode was simulated and analysed.The results showed that the uniformity of magnetic field distribution on target surface is improved effectively.The interstitial magnetic field distribution between cathode assembly and anode frame is changed by mounting a plate of high magnetic conductivity onto the inner side of anode frame,thus solving the problem of the interstitially continuous discharge.This design provides a reference for the target cathode for magnetron sputtering.

Key concepts: Cathode, Anode, Cavity magnetron, Magnetic field, Materials science, Sputter deposition, Sputtering, Optoelectronics

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