Electroless Copper Plating Technology for Graphite Powder
Lixia Shen
Abstract
Lixia Shen
Abstract
Electroless plating method was employed to deposit copper on graphite surface in order to solve the Cu/C interface problem in pantograph slide manufacture,where bluestone is used as the solute and zinc powder as the reductant.The influence factors(solute concentration,acetic acid concentration,temperature and reaction time) were investigated.The experiment indicates that the Cu coating,prepared by the electroless plating,is uniform,dense and integrated well with graphite surface(sawtooth-like interface) when the conditions of bluestone concentration 60 g/L,Zinc 24 g/L,acetic acid 14~18 mL/L,deposition time 40 min,deposition temperature 35℃.
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Electroless plating method was employed to deposit copper on graphite surface in order to solve the Cu/C interface problem in pantograph slide manufacture,where bluestone is used as the solute and zinc powder as the reductant.The influence factors(solute concentration,acetic acid concentration,temperature and reaction time) were investigated.The experiment indicates that the Cu coating,prepared by the electroless plating,is uniform,dense and integrated well with graphite surface(sawtooth-like interface) when the conditions of bluestone concentration 60 g/L,Zinc 24 g/L,acetic acid 14~18 mL/L,deposition time 40 min,deposition temperature 35℃.
Key concepts: Graphite, Copper, Materials science, Coating, Zinc, Acetic acid, Plating (geology), Metallurgy