2009Cailiao baohuRequires access

Technology for Electroless Copper Plating on Graphite Powders and Its Efficacy

Guangchun Yao

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Abstract

Graphite particles were successfully coated by electro-less copper plating, using Zn powders as the reducing agent, ace-tic acid as the disperser and CuS04·5H2O as the main salt. The effects of concentration of CuSO4·5H2 0, dose of Zn powders and acetic acid, and temperature and time on the properties of the electroless Cu coating were investigated. And the optimized pa-rameters for electroless Cu plating of graphite powders were estab-lished. It was found that compared with conventional electroless copper plating system of formalin, the present technology had re-markably increased effective loadage, accelerated reaction rate, shortened reaction time, and decreased reaction temperature. And it led no pollution to environment, due to exclusion of forma-lin.

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What this paper is about

Graphite particles were successfully coated by electro-less copper plating, using Zn powders as the reducing agent, ace-tic acid as the disperser and CuS04·5H2O as the main salt. The effects of concentration of CuSO4·5H2 0, dose of Zn powders and acetic acid, and temperature and time on the properties of the electroless Cu coating were investigated. And the optimized pa-rameters for electroless Cu plating of graphite powders were estab-lished. It was found that compared with conventional electroless copper plating system of formalin, the present technology had re-markably increased effective loadage, accelerated reaction rate, shortened reaction time, and decreased reaction temperature. And it led no pollution to environment, due to exclusion of forma-lin.

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Available abstract

Graphite particles were successfully coated by electro-less copper plating, using Zn powders as the reducing agent, ace-tic acid as the disperser and CuS04·5H2O as the main salt. The effects of concentration of CuSO4·5H2 0, dose of Zn powders and acetic acid, and temperature and time on the properties of the electroless Cu coating were investigated. And the optimized pa-rameters for electroless Cu plating of graphite powders were estab-lished. It was found that compared with conventional electroless copper plating system of formalin, the present technology had re-markably increased effective loadage, accelerated reaction rate, shortened reaction time, and decreased reaction temperature. And it led no pollution to environment, due to exclusion of forma-lin.

Key concepts: Materials science, Copper, Graphite, Electroless plating, Metallurgy, Plating (geology), Copper plating, Reducing agent

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