2006Cailiao daobaoRequires access

Development Prospect of Microelectronics Chip Interconnection Technology and Materials

Yunfei Du

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Abstract

Chip interconnection is an important part in the microelectronics parts manufacture process. The characteristics and methods of the interconnection technology for microelectronics parts are summarized The research progress of wire bonding and flip chip bonding materials are introduced mainly, and the evolutional way of them are indicated

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What this paper is about

Chip interconnection is an important part in the microelectronics parts manufacture process. The characteristics and methods of the interconnection technology for microelectronics parts are summarized The research progress of wire bonding and flip chip bonding materials are introduced mainly, and the evolutional way of them are indicated

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Available abstract

Chip interconnection is an important part in the microelectronics parts manufacture process. The characteristics and methods of the interconnection technology for microelectronics parts are summarized The research progress of wire bonding and flip chip bonding materials are introduced mainly, and the evolutional way of them are indicated

Key concepts: Microelectronics, Interconnection, Flip chip, Materials science, Wire bonding, Chip, Engineering physics, Nanotechnology

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