Development Prospect of Microelectronics Chip Interconnection Technology and Materials
Yunfei Du
Abstract
Yunfei Du
Abstract
Chip interconnection is an important part in the microelectronics parts manufacture process. The characteristics and methods of the interconnection technology for microelectronics parts are summarized The research progress of wire bonding and flip chip bonding materials are introduced mainly, and the evolutional way of them are indicated
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Chip interconnection is an important part in the microelectronics parts manufacture process. The characteristics and methods of the interconnection technology for microelectronics parts are summarized The research progress of wire bonding and flip chip bonding materials are introduced mainly, and the evolutional way of them are indicated
Key concepts: Microelectronics, Interconnection, Flip chip, Materials science, Wire bonding, Chip, Engineering physics, Nanotechnology