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Development of microelectronics connecting technology

Licheng Xu

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Abstract

Microelectronics connecting technology plays an important role in the microelectronics packaging. From the development of the microelectronics packaging, this paper described the application of the microelectronics connecting technology such as the WB, TAB, FCB of the chips soldering technology, as well as the wave-soldering, reflow-soldering which are applied in the automatic and mass-production microelectronics assembling, and analyzed the trend of their development. Similarly compared with the characteristics of the lead-free solders of different systems, it is concluded that the series of Sn-Ag-Cu solder is the preferable option at present. Microelectronics connecting technology will trend to meet the needs of the environment, the miniaturization and the high capability.

About this research paper

What this paper is about

Microelectronics connecting technology plays an important role in the microelectronics packaging. From the development of the microelectronics packaging, this paper described the application of the microelectronics connecting technology such as the WB, TAB, FCB of the chips soldering technology, as well as the wave-soldering, reflow-soldering which are applied in the automatic and mass-production microelectronics assembling, and analyzed the trend of their development. Similarly compared with the characteristics of the lead-free solders of different systems, it is concluded that the series of Sn-Ag-Cu solder is the preferable option at present. Microelectronics connecting technology will trend to meet the needs of the environment, the miniaturization and the high capability.

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Available abstract

Microelectronics connecting technology plays an important role in the microelectronics packaging. From the development of the microelectronics packaging, this paper described the application of the microelectronics connecting technology such as the WB, TAB, FCB of the chips soldering technology, as well as the wave-soldering, reflow-soldering which are applied in the automatic and mass-production microelectronics assembling, and analyzed the trend of their development. Similarly compared with the characteristics of the lead-free solders of different systems, it is concluded that the series of Sn-Ag-Cu solder is the preferable option at present. Microelectronics connecting technology will trend to meet the needs of the environment, the miniaturization and the high capability.

Key concepts: Microelectronics, Soldering, Miniaturization, Manufacturing engineering, Engineering, Materials science, Electrical engineering, Metallurgy

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