2012•한국진공학회 학술발표회초록집Requires access

Copper Interconnection and Flip Chip Packaging Laboratory Activity for Microelectronics Manufacturing Engineers

Daeho Moon, Taemin Ha, Boomsoo Kim, Seungsoo Han, Sang Jeen Hong

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Key concepts: Microelectronics, Flip chip, Interconnection, Integrated circuit packaging, Thermal copper pillar bump, Chip, Electronic packaging, Chip-scale package

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Copper Interconnection and Flip Chip Packaging Laboratory Activity for Microelectronics Manufacturing Engineers — Research Paper | ScholarLens