2007Electroplating & FinishingRequires access

Electroless silver plating on hollow microsphere

Shen Lan-ping

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Abstract

The surface of hollow microsphere was modified by using titanate coupling agents, and was then treated by ultrasonic assisted electroless silver plating. The structure, surface morphology and composition of the deposit were analyzed through SEM、EDX、XRD and XPS. The results indicate that the electrical conductivity of hollow microsphereis different as a result varied reducing agents with glucose being the best. The surface morphology of hollow microsphere is varies apparently different with reducing agents, resultingin different reflectionspectra.

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What this paper is about

The surface of hollow microsphere was modified by using titanate coupling agents, and was then treated by ultrasonic assisted electroless silver plating. The structure, surface morphology and composition of the deposit were analyzed through SEM、EDX、XRD and XPS. The results indicate that the electrical conductivity of hollow microsphereis different as a result varied reducing agents with glucose being the best. The surface morphology of hollow microsphere is varies apparently different with reducing agents, resultingin different reflectionspectra.

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Available abstract

The surface of hollow microsphere was modified by using titanate coupling agents, and was then treated by ultrasonic assisted electroless silver plating. The structure, surface morphology and composition of the deposit were analyzed through SEM、EDX、XRD and XPS. The results indicate that the electrical conductivity of hollow microsphereis different as a result varied reducing agents with glucose being the best. The surface morphology of hollow microsphere is varies apparently different with reducing agents, resultingin different reflectionspectra.

Key concepts: Microsphere, Materials science, Plating (geology), Morphology (biology), X-ray photoelectron spectroscopy, Electroless plating, Reducing agent, Chemical engineering

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