Study on curing kinetics of epoxy group silane /cyanate ester resin modified with silica particle

The non-isothermal curing kinetics of epoxy group silane/cyanate ester resin modified with silica particle composites was investigated by using the differential scanning calorimetry (DSC). The curing kinetics parameters of the modified system were obtained by Kissinger equation and Ozawa equation. Based on the Kissinger equation and Ozawa equation, the apparent activation energy was 66.09kJ/mol and 70.01kJ/mol, respectively. The order of the curing reaction is 0.89 by Crane's theory. Frequency factors and rate constants for the reactions at different temperature in different Heating Rates were calculated. The curing process parameters were obtained as folloes: gel temperature of 130.74 ℃, curing temperature of 160.96 ℃ and post-treating temperature of 199.16℃. The appropriate solidifying process of modified cyanate ester resin was determined. Compared to the E-Si/CE system, the results indicated that the addition of SiO2 can lower the activation energy of the E-Si/CE system and the curing reaction can occur at a relative low temperature.