2006•Electronics Process TechnologyRequires access

Analyse of the Failure Mode of Solder Joint

Huang Ping

Abstract

Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.Carry on temperature cycle test on typical components,inspects solder joint crack in different cycle,observe microstructure of solder joint in virtue of metallographic analyse,study solder joint failure mode in temperature cycle and offer basis to improve technology parameter.

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Available abstract

Key concepts: Soldering, Joint (building), Materials science, Failure mode and effects analysis, Microstructure, Metallurgy, Mode (computer interface), Structural engineering