2012•Unpublished venueRequires access

Failure mode of SAC305 lead-free solder joint under thermal stress

Chao Huang, Daoguo Yang, Boyi Wu, Lili Liang, Yang Yu

Abstract

With the progress of the lead-free in electronics industry, the reliability of SAC 305 lead-free solder joint is particularly important. According to typical components (BGA) suffering from thermal cycling and thermal aging test, present the fatigue life of the solder joint. Check the solder joint cracking at different cycling. Cross section and metallographic microscope are performed to inspect the microstructure of the lead-free solder joint. Study the solder joint failure analysis under thermal cycling and thermal aging. Guide subsequent reliability test and failure analysis.

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Available abstract

Key concepts: Soldering, Temperature cycling, Ball grid array, Joint (building), Failure mode and effects analysis, Materials science, Reliability (semiconductor), Lead (geology)