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2020•Transactions of The Japan Institute of Electronics PackagingOpen access

Electrical Resistance of Cu-Cu Interconnection Using Electroless Ni(P) and Au Plating

Z. D. Ma, H. T. Hung, Chengheng Robert Kao, Y. H. Chen

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Abstract

The electrical resistance of interconnection fabricated by electroless Ni(P) and Au plating was measured by four-point probe measurement technique. Prior to the bonding, the average electrical resistance of electroplated copper pillars was 0.21 mΩ. After bonding with electroless Ni(P) plating, the average electrical resistance of joints was 8.4 mΩ and even decreased to 4.8 mΩ with 400°C post-aging process. As for bonding with electroless Au plating, two different kinds of surface finish processes were applied. The averaged electrical resistances of electroless nickel immersion gold (ENIG) joints and direct immersion gold (DIG) joints were 3.00 mΩ and 1.76 mΩ, respectively. In comparison with conventional SnAgCu solder joints (760 μm) (7.1 mΩ,), joints bonding with electroless plating has smaller electrical resistance.

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The electrical resistance of interconnection fabricated by electroless Ni(P) and Au plating was measured by four-point probe measurement technique. Prior to the bonding, the average electrical resistance of electroplated copper pillars was 0.21 mΩ. After bonding with electroless Ni(P) plating, the average electrical resistance of joints was 8.4 mΩ and even decreased to 4.8 mΩ with 400°C post-aging process. As for bonding with electroless Au plating, two different kinds of surface finish processes were applied. The averaged electrical resistances of electroless nickel immersion gold (ENIG) joints and direct immersion gold (DIG) joints were 3.00 mΩ and 1.76 mΩ, respectively. In comparison with conventional SnAgCu solder joints (760 μm) (7.1 mΩ,), joints bonding with electroless plating has smaller electrical resistance.

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Available abstract

The electrical resistance of interconnection fabricated by electroless Ni(P) and Au plating was measured by four-point probe measurement technique. Prior to the bonding, the average electrical resistance of electroplated copper pillars was 0.21 mΩ. After bonding with electroless Ni(P) plating, the average electrical resistance of joints was 8.4 mΩ and even decreased to 4.8 mΩ with 400°C post-aging process. As for bonding with electroless Au plating, two different kinds of surface finish processes were applied. The averaged electrical resistances of electroless nickel immersion gold (ENIG) joints and direct immersion gold (DIG) joints were 3.00 mΩ and 1.76 mΩ, respectively. In comparison with conventional SnAgCu solder joints (760 μm) (7.1 mΩ,), joints bonding with electroless plating has smaller electrical resistance.

Key concepts: Materials science, Interconnection, Soldering, Electroplating, Plating (geology), Electroless plating, Electrical resistance and conductance, Metallurgy

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