2004IEEE Electron Device LettersRequires access

Temperature Dependence of Submicrometer Strained-Si Surface Channel n-Type MOSFETs in DT Mode

V. Gaspari, Kristel Fobelets, P.W. Ding, J.E. Velázquez-Pérez, Sarah H. Olsen, A.G. O’Neill, J. Zhang

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Abstract

The dynamic threshold (DT) behavior of strained-Si (s-Si) n-type surface channel MOSFETs has been investigated for operating temperatures ranging from 10 to 300 K. The temperature dependence of the coefficients governing the body effect is presented, and their influence on the performance enhancement due to DT-mode operation is analyzed. The maximum transconductance is higher for the s-Si MOSFET in both operating modes over the whole temperature range. The relative improvement of the maximum transconductance between normal and DT-mode operation is found to be lower for the s-Si MOSFET (30%) compared to the Si control MOSFET (55%) over the whole temperature range. The subthreshold slope for the Si control follows the calculated behavior in both normal and DT-mode, and the subthreshold performance enhancement of the s-Si device due to DT-mode operation is closely approximated by the theoretical value (26%).

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What this paper is about

The dynamic threshold (DT) behavior of strained-Si (s-Si) n-type surface channel MOSFETs has been investigated for operating temperatures ranging from 10 to 300 K. The temperature dependence of the coefficients governing the body effect is presented, and their influence on the performance enhancement due to DT-mode operation is analyzed. The maximum transconductance is higher for the s-Si MOSFET in both operating modes over the whole temperature range. The relative improvement of the maximum transconductance between normal and DT-mode operation is found to be lower for the s-Si MOSFET (30%) compared to the Si control MOSFET (55%) over the whole temperature range. The subthreshold slope for the Si control follows the calculated behavior in both normal and DT-mode, and the subthreshold performance enhancement of the s-Si device due to DT-mode operation is closely approximated by the theoretical value (26%).

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Available abstract

The dynamic threshold (DT) behavior of strained-Si (s-Si) n-type surface channel MOSFETs has been investigated for operating temperatures ranging from 10 to 300 K. The temperature dependence of the coefficients governing the body effect is presented, and their influence on the performance enhancement due to DT-mode operation is analyzed. The maximum transconductance is higher for the s-Si MOSFET in both operating modes over the whole temperature range. The relative improvement of the maximum transconductance between normal and DT-mode operation is found to be lower for the s-Si MOSFET (30%) compared to the Si control MOSFET (55%) over the whole temperature range. The subthreshold slope for the Si control follows the calculated behavior in both normal and DT-mode, and the subthreshold performance enhancement of the s-Si device due to DT-mode operation is closely approximated by the theoretical value (26%).

Key concepts: Transconductance, MOSFET, Subthreshold conduction, Materials science, Subthreshold slope, Optoelectronics, Atmospheric temperature range, Threshold voltage

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