Microelectromechanical systems (MEMS): an overview of current state-of-the-art

The applications and basics of microelectromechanical systems (MEMS) are discussed. The four main silicon micromachining techniques, i.e., bulk micromachining, surface micromachining, wafer-to-wafer bonding, and high aspect ratio micromachining are presented in detail. A microelectromechanical quartz rate sensor is also discussed. These techniques have been adapted to applications in the aerospace, military, industrial, medical, telecommunications and automotive industries to realize miniaturized highly integrated MEMS in a cost effective manner.