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Thermal cycling test results of CSP and RF assemblies
Reza Ghaffarian, G.E. Nelson, Matthew Cooper, D.C.C. Lam, Steve Strudler, Abhay Umdekar, K. Selk, Bill Bjorndahl, Randy Duprey
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Abstract
A JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.