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CSP Reliability for Single-and Double-Sided Assemblies

Reza Ghaffarian

Open publisher page 5 citations

Abstract

This paper reviews the package trend towards further miniaturization of emerging chip scale package (CSP).

About this research paper

What this paper is about

This paper reviews the package trend towards further miniaturization of emerging chip scale package (CSP).

Why it matters

OpenAlex reports 5 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

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Available abstract

This paper reviews the package trend towards further miniaturization of emerging chip scale package (CSP).

Key concepts: Reliability (semiconductor), Computer science, Reliability engineering, Engineering, Physics, Power (physics), Quantum mechanics

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CSP Reliability for Single-and Double-Sided Assemblies — Research Paper | ScholarLens