Research on Crafts of Ni-P-SiC Electroless Composite Plating on Surface Performances of the Mould
Jun Ying Hou, Chuan Sheng Wang, Yang Bai
Abstract
Jun Ying Hou, Chuan Sheng Wang, Yang Bai
Abstract
Experiments of Ni-P-SiC chemical composite plating were carried out, and then the crafts and performances of Ni-P-SiC chemical composite plating were investigated. Based on the previous researches of the chemical composite plating, different amount of SiC particles and different conditions of technologies were selected. After experiments, the distribution surface particles, the metallographic structure and hardness of composite coatings were characterized by using a XJZ-6A type metalloscope and a HVS1000 type micro-hardometer, respectively. The results show that the composite coatings have bright surface appearance. Besides having a higher hardness, composite coatings combine well with the matrix and the deposition rate is quick. In the factors which influenced the properties of the composite coatings, the amount of SiC particles and plating time are analyzed.
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Experiments of Ni-P-SiC chemical composite plating were carried out, and then the crafts and performances of Ni-P-SiC chemical composite plating were investigated. Based on the previous researches of the chemical composite plating, different amount of SiC particles and different conditions of technologies were selected. After experiments, the distribution surface particles, the metallographic structure and hardness of composite coatings were characterized by using a XJZ-6A type metalloscope and a HVS1000 type micro-hardometer, respectively. The results show that the composite coatings have bright surface appearance. Besides having a higher hardness, composite coatings combine well with the matrix and the deposition rate is quick. In the factors which influenced the properties of the composite coatings, the amount of SiC particles and plating time are analyzed.
Key concepts: Composite number, Materials science, Plating (geology), Composite material, Electroless plating, Deposition (geology), Metallurgy, Layer (electronics)