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Research on Ni-SiC Composite Electroplating Process

YU Shu-min

Abstract

Ni-SiC composite plating was fabricated by CECD method where SiC particles were suspended in Ni plating solution. The effects of current density and SiC particles concentration in plating solution on SiC content in composite plating were studied. It was shown that increasing SiC content in composite plating can remarkably improve hardness of composite plating.

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Available abstract

Key concepts: Plating (geology), Composite number, Electroplating, Materials science, Metallurgy, Composite material, Layer (electronics), Geology