Thin a‐SiC:H Films Formed by Remote Hydrogen Microwave Plasma CVD using Dimethylsilane and Trimethylsilane Precursors
A. M. Wróbel, A. Walkiewicz‐Pietrzykowska, Paweł Uznański
Abstract
A. M. Wróbel, A. Walkiewicz‐Pietrzykowska, Paweł Uznański
Abstract
The effect of substrate temperature (TS) on the chemical structure, surface morphology, density, and adhesion to a substrate of a‐SiC:H films is reported. The increase in TS from 30 °C to 400 °C causes the elimination of organic moieties from the film and the formation of Si‐carbidic network. The films produced at high TS are morphologically homogeneous, dense, and strongly adhere to coatings.
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The effect of substrate temperature (TS) on the chemical structure, surface morphology, density, and adhesion to a substrate of a‐SiC:H films is reported. The increase in TS from 30 °C to 400 °C causes the elimination of organic moieties from the film and the formation of Si‐carbidic network. The films produced at high TS are morphologically homogeneous, dense, and strongly adhere to coatings.
Key concepts: Dimethylsilane, Trimethylsilane, Substrate (aquarium), Materials science, Thin film, Chemical engineering, Homogeneous, Adhesion