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2011•Microelectronic EngineeringRequires access

A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

Emeka H. Amalu, Wai Tak Lau, N.N. Ekere, Raj Bhatti, Sabuj Mallik, Kenny C. Otiaba, G. Takyi

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Key concepts: Stencil, Solder paste, Surface-mount technology, Soldering, Reflow soldering, Printed circuit board, Materials science, Ball grid array

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A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits — Research Paper | ScholarLens