The Quality Control in SMT Solder-Paste Printing
Ming Geng
Abstract
Ming Geng
Abstract
In surface mount processes,stencil printing plays an important part,and the control has effect on the quality of assemblies.In the article,all the factors which control the stencil printing process,such as the characteristic of solder paste,design and manufacture of stencil,the optimization of variables for printer setting up and other issues are discussed.
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In surface mount processes,stencil printing plays an important part,and the control has effect on the quality of assemblies.In the article,all the factors which control the stencil printing process,such as the characteristic of solder paste,design and manufacture of stencil,the optimization of variables for printer setting up and other issues are discussed.
Key concepts: Stencil, Solder paste, Surface-mount technology, Soldering, Quality (philosophy), Process (computing), Engineering drawing, Control (management)