1999Electronics Process TechnologyRequires access

The Quality Control in SMT Solder-Paste Printing

Ming Geng

Open publisher page 1 citations

Abstract

In surface mount processes,stencil printing plays an important part,and the control has effect on the quality of assemblies.In the article,all the factors which control the stencil printing process,such as the characteristic of solder paste,design and manufacture of stencil,the optimization of variables for printer setting up and other issues are discussed.

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What this paper is about

In surface mount processes,stencil printing plays an important part,and the control has effect on the quality of assemblies.In the article,all the factors which control the stencil printing process,such as the characteristic of solder paste,design and manufacture of stencil,the optimization of variables for printer setting up and other issues are discussed.

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OpenAlex reports 1 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

In surface mount processes,stencil printing plays an important part,and the control has effect on the quality of assemblies.In the article,all the factors which control the stencil printing process,such as the characteristic of solder paste,design and manufacture of stencil,the optimization of variables for printer setting up and other issues are discussed.

Key concepts: Stencil, Solder paste, Surface-mount technology, Soldering, Quality (philosophy), Process (computing), Engineering drawing, Control (management)

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