ScholarLens Back to search
1990•Soldering and Surface Mount TechnologyRequires access

Stencil Printing of Solder Paste for Fine‐pitch Surface Mount Assembly

John R. Morris, Thaddeus Wojcik

Open publisher page 2 citations

Abstract

The increasing availability and use of fine pitch integrated circuit packages place increased demands on the stencil printing process for solder paste deposition. To attain the resolution needed for high assembly yields, both materials and operating parameters must be optimised. The resultant deposits must be uniform and of the proper geometry to promote satisfactory device placement and reflow. This paper summarises findings in the following areas:

About this research paper

What this paper is about

The increasing availability and use of fine pitch integrated circuit packages place increased demands on the stencil printing process for solder paste deposition. To attain the resolution needed for high assembly yields, both materials and operating parameters must be optimised. The resultant deposits must be uniform and of the proper geometry to promote satisfactory device placement and reflow. This paper summarises findings in the following areas:

Why it matters

OpenAlex reports 2 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

The increasing availability and use of fine pitch integrated circuit packages place increased demands on the stencil printing process for solder paste deposition. To attain the resolution needed for high assembly yields, both materials and operating parameters must be optimised. The resultant deposits must be uniform and of the proper geometry to promote satisfactory device placement and reflow. This paper summarises findings in the following areas:

Key concepts: Stencil, Solder paste, Surface-mount technology, Soldering, Printed circuit board, Wave soldering, Mount, Deposition (geology)

Related papers

Related paper 1Related paper 2Related paper 3
Back to paper searchBrowse research topicsOriginal source
Stencil Printing of Solder Paste for Fine‐pitch Surface Mount Assembly — Research Paper | ScholarLens