1994Japanese Journal of Applied PhysicsOpen access

Disk-Shaped Stacked Capacitor Cell for 256 Mb Dynamic Random-Access Memory

Toshinori Morihara, Yoshikazu Ohno, Takahisa Eimori, T. Katayama, Shin-ichi SATOH, Tadashi Nishimura Tadashi Nishimura, Hirokazu Miyoshi

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Abstract

A new cell structure using the disk-shaped stacked capacitor is proposed for 256 Mb dynamic random-access memory (DRAM). This capacitor structure is formed on the sidewall of a cylindrical storage node by means of a self-alignment method. The lithographic process of the disk-shaped storage node is the same as that of the cylindrical one. The distance between adjacent storage node patterns of 0.1 µ m can be realized beyond the limits set by lithographic resolution. It is estimated that the capacitance of 25 fF/cell can be obtained in the 0.4 µ m storage node height in a 0.72 µ m2 cell area. The disk-shaped stacked capacitor, to which ON dielectric film (t eq=4 or 5 nm) is applied, is investigated with regard to electrical characteristics.

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A new cell structure using the disk-shaped stacked capacitor is proposed for 256 Mb dynamic random-access memory (DRAM). This capacitor structure is formed on the sidewall of a cylindrical storage node by means of a self-alignment method. The lithographic process of the disk-shaped storage node is the same as that of the cylindrical one. The distance between adjacent storage node patterns of 0.1 µ m can be realized beyond the limits set by lithographic resolution. It is estimated that the capacitance of 25 fF/cell can be obtained in the 0.4 µ m storage node height in a 0.72 µ m2 cell area. The disk-shaped stacked capacitor, to which ON dielectric film (t eq=4 or 5 nm) is applied, is investigated with regard to electrical characteristics.

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Available abstract

A new cell structure using the disk-shaped stacked capacitor is proposed for 256 Mb dynamic random-access memory (DRAM). This capacitor structure is formed on the sidewall of a cylindrical storage node by means of a self-alignment method. The lithographic process of the disk-shaped storage node is the same as that of the cylindrical one. The distance between adjacent storage node patterns of 0.1 µ m can be realized beyond the limits set by lithographic resolution. It is estimated that the capacitance of 25 fF/cell can be obtained in the 0.4 µ m storage node height in a 0.72 µ m2 cell area. The disk-shaped stacked capacitor, to which ON dielectric film (t eq=4 or 5 nm) is applied, is investigated with regard to electrical characteristics.

Key concepts: Dynamic random-access memory, Dram, Capacitor, Node (physics), Capacitance, Lithography, Materials science, Optoelectronics

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