Disk-Shaped Stacked Capacitor Cell for 256 Mb Dynamic Random-Access Memory
Toshinori Morihara, Yoshikazu Ohno, Takahisa Eimori, T. Katayama, Shin-ichi SATOH, Tadashi Nishimura Tadashi Nishimura, Hirokazu Miyoshi
Abstract
Open-access reader
Toshinori Morihara, Yoshikazu Ohno, Takahisa Eimori, T. Katayama, Shin-ichi SATOH, Tadashi Nishimura Tadashi Nishimura, Hirokazu Miyoshi
Abstract
Open-access reader
A new cell structure using the disk-shaped stacked capacitor is proposed for 256 Mb dynamic random-access memory (DRAM). This capacitor structure is formed on the sidewall of a cylindrical storage node by means of a self-alignment method. The lithographic process of the disk-shaped storage node is the same as that of the cylindrical one. The distance between adjacent storage node patterns of 0.1 µ m can be realized beyond the limits set by lithographic resolution. It is estimated that the capacitance of 25 fF/cell can be obtained in the 0.4 µ m storage node height in a 0.72 µ m2 cell area. The disk-shaped stacked capacitor, to which ON dielectric film (t eq=4 or 5 nm) is applied, is investigated with regard to electrical characteristics.
OpenAlex reports 3 citations for this work. Citation counts describe recorded attention and do not establish research quality.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
A new cell structure using the disk-shaped stacked capacitor is proposed for 256 Mb dynamic random-access memory (DRAM). This capacitor structure is formed on the sidewall of a cylindrical storage node by means of a self-alignment method. The lithographic process of the disk-shaped storage node is the same as that of the cylindrical one. The distance between adjacent storage node patterns of 0.1 µ m can be realized beyond the limits set by lithographic resolution. It is estimated that the capacitance of 25 fF/cell can be obtained in the 0.4 µ m storage node height in a 0.72 µ m2 cell area. The disk-shaped stacked capacitor, to which ON dielectric film (t eq=4 or 5 nm) is applied, is investigated with regard to electrical characteristics.
Key concepts: Dynamic random-access memory, Dram, Capacitor, Node (physics), Capacitance, Lithography, Materials science, Optoelectronics