Highly uniform ion implants into GaAs by wafer rotation
Naotaka Uchitomi, Hitoshi Mikami, Nobuyuki Toyoda
Abstract
Naotaka Uchitomi, Hitoshi Mikami, Nobuyuki Toyoda
Abstract
The influence of wafer rotation on implanted dose uniformity was investigated using thermal-wave measurement to realize highly uniform ion implants into a (001) wafer. It was found that conically rotating ion implantation is an effective way to scramble the scanning ion beam during implantation by using an electrostatic-scan implantation system with a specially designed wafer station. Furthermore, two-fold ion implantation was employed to correct the dose inhomogeneity caused by the variation of the tilt angle across a wafer. Based on these considerations, a high dose uniformity of less than 1% across a wafer was achieved.
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The influence of wafer rotation on implanted dose uniformity was investigated using thermal-wave measurement to realize highly uniform ion implants into a (001) wafer. It was found that conically rotating ion implantation is an effective way to scramble the scanning ion beam during implantation by using an electrostatic-scan implantation system with a specially designed wafer station. Furthermore, two-fold ion implantation was employed to correct the dose inhomogeneity caused by the variation of the tilt angle across a wafer. Based on these considerations, a high dose uniformity of less than 1% across a wafer was achieved.
Key concepts: Wafer, Ion implantation, Materials science, Rotation (mathematics), Ion, Ion beam, Tilt (camera), Optoelectronics