2002•Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIERequires access
Wafer lever packaging for gyroscope by Au/Si eutectic bonding
Yong Ruan, Dacheng Zhang, Zhenchuan Yang, Xiang Wang, Xiaomei Yu
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Abstract
This paper will focus on Au/Si eutectic bonding technology. We have set up and improved some MEMS models concerning this technique for discussion. Annealing temperature on bonding was also taken into consideration. Since hydrophilic surface has a large number of —OH groups, which can make two wafers in contact, we derive a hydrophilic surface from dipping the wafer in H2O /H202/NH4OH solution. Especially we use MEMS models with ANSYS to simulate and guide the fabrication of MEMS device. Furthermore, we have improved MEMS structure. Because its bonding temperature, voltage and pressure are low, by using the following technique we could get high density and more reliable MEMS device. We also have used this technology to fabricate gyroscope and some other MEMS devices. Classical Au/Si fusion bonding at 1000°C, and anodic at 450°C is not a commercially feasible process. We achieved AU/Si eutectic bonding technology for gyroscope and other MEMS device manufacture.