2012•Key engineering materialsOpen access

Status and Trends of Fixed Abrasive Polishing on Semiconductor

Yunmei Zhao, Dun Wen Zuo, Yu Li Sun

Abstract

The necessity of fixed abrasive CMP in polishing semiconductor materials processing was analyzed. Compared the shortcomings of traditional free abrasive polishing with the advantages of fixed abrasive polishing, the applications of fixed abrasive polishing technology in semiconductor processing were described. A variety of fixed abrasive polishing pad production methods were introduced. The development trend of fixed abrasive polishing was prospected.

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Available abstract

Key concepts: Polishing, Abrasive, Chemical-mechanical planarization, Materials science, Metallurgy, Semiconductor, Optoelectronics