2010•Machinery Design and ManufactureRequires access

Study the chemical mechanical polishing on sapphire substrate

Xifu Chen

Abstract

Chemical-mechanical polishing(Chemical Mechanical Polishing,CMP)is currently only able to provide the global planarization technology,its mechanism of polishing is currently the most popular. A survey of some models was given which consider the polishing properties of polishing liquid and polishin pads,and the relevant characteristics of each model was analyzed,at last the development and research directions of the CMP model was prospected.

About this research paper

What this paper is about

Why it matters

A significance statement is not available in the OpenAlex record.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

Key concepts: Chemical-mechanical planarization, Polishing, Materials science, Sapphire, Substrate (aquarium), Mechanical engineering, Composite material, Engineering