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1995•Journal of Materials Science Materials in ElectronicsRequires access

Flow processes in solder paste during stencil printing for SMT assembly

S.H. Mannan, N.N. Ekere, Ismayadi Ismail, Mark Currie

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Key concepts: Solder paste, Stencil, Soldering, Surface-mount technology, Materials science, Rheology, Reflow soldering, Composite material

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