2015•Microelectronics ReliabilityRequires access

Numerical simulation and fatigue life estimation of BGA packages under random vibration loading

Fang Liu, Ye Lü, Zhen Wang, Zhiming Zhang

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Key concepts: Ball grid array, Random vibration, Soldering, Vibration, Structural engineering, Vibration fatigue, Printed circuit board, Displacement (psychology)

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Numerical simulation and fatigue life estimation of BGA packages under random vibration loading — Research Paper | ScholarLens