Silicon-on-silicon multichip modules: technology and applications
W.W.-M. Dai
Abstract
W.W.-M. Dai
Abstract
The long awaited Multi-Chip Module (MCM) market has finally arrived. This paper presents the state-of-the-art of the silicon-on-silicon MCM technology and describes some typical MCM products for both high performance digital applications and low cost mixed signal applications. By low cost silicon-on-silicon MCMs, we mean a few chip MCMs on a small silicon substrate which can be packaged into a standard IC package. Low cost silicon-on-silicon MCMs will continue to pave the way for accelerating the commercial availability and utilization of the technology.
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The long awaited Multi-Chip Module (MCM) market has finally arrived. This paper presents the state-of-the-art of the silicon-on-silicon MCM technology and describes some typical MCM products for both high performance digital applications and low cost mixed signal applications. By low cost silicon-on-silicon MCMs, we mean a few chip MCMs on a small silicon substrate which can be packaged into a standard IC package. Low cost silicon-on-silicon MCMs will continue to pave the way for accelerating the commercial availability and utilization of the technology.
Key concepts: Silicon, Silicon chip, Substrate (aquarium), Hybrid silicon laser, Chip, Computer science, Electronic engineering, Materials science