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1994•DSpace@MIT (Massachusetts Institute of Technology)Open access

Real time process monitoring of solder paste stencil printing

Daniel J. Braunstein

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Abstract

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.

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Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.

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OpenAlex reports 2 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.

Key concepts: Solder paste, Stencil, Process (computing), Soldering, Process engineering, Manufacturing engineering, Materials science, Computer science

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