2022•2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT)Requires access

A Package on Package Assembly Method of SiP Microwave Module based on Heteroid BGA Devices

Ruhao Sun, Cheng Wang, Wei Wei, Xie Lu, Bingcheng Mao

Abstract

System in package (SiP) technology provides new development for microwave modules of improving package density and integration level. In this paper, the process flow of package-on-package (PoP) assembly of SiP microwave module based on heteroid ball grid array is designed. The parameters of interconnected alloy balls, stencil and temperature are proposed. The stacking quality, accuracy and strength of interconnections are inspected. The method can be applied in manufacturing PoP microwave modules below 18GHz.

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Available abstract

Key concepts: Ball grid array, Package on package, System in package, Microwave, Grid, Computer science, Stacking, Quad Flat No-leads package