2022Unpublished venueRequires access

Photolithography (Lithography)

Yaguang Lian

Open publisher page 1 citations

Abstract

Photolithography is to make device patterns on the surface of semiconductor substrate. During photolithography, ultraviolet light passes through the pattern windows of the mask, and the intensity that the photoresist receives is uniform. This chapter discusses the lithography process. In the lithography process, the design of photomask is also an important topic. The chapter focuses on the alignment mark on the mask used for manual alignment. Several points need to be considered in the design of the alignment mark, which are often encountered in university laboratories and clean rooms. To avoid absorption, the light system of an extreme ultraviolet lithography machine adopts a reflective mirror structure, and the photomask also adopts this structure. The optical system is placed in a vacuum chamber, and the wafer and the mask are also placed in a vacuum chamber.

About this research paper

What this paper is about

Photolithography is to make device patterns on the surface of semiconductor substrate. During photolithography, ultraviolet light passes through the pattern windows of the mask, and the intensity that the photoresist receives is uniform. This chapter discusses the lithography process. In the lithography process, the design of photomask is also an important topic. The chapter focuses on the alignment mark on the mask used for manual alignment. Several points need to be considered in the design of the alignment mark, which are often encountered in university laboratories and clean rooms. To avoid absorption, the light system of an extreme ultraviolet lithography machine adopts a reflective mirror structure, and the photomask also adopts this structure. The optical system is placed in a vacuum chamber, and the wafer and the mask are also placed in a vacuum chamber.

Why it matters

OpenAlex reports 1 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

Photolithography is to make device patterns on the surface of semiconductor substrate. During photolithography, ultraviolet light passes through the pattern windows of the mask, and the intensity that the photoresist receives is uniform. This chapter discusses the lithography process. In the lithography process, the design of photomask is also an important topic. The chapter focuses on the alignment mark on the mask used for manual alignment. Several points need to be considered in the design of the alignment mark, which are often encountered in university laboratories and clean rooms. To avoid absorption, the light system of an extreme ultraviolet lithography machine adopts a reflective mirror structure, and the photomask also adopts this structure. The optical system is placed in a vacuum chamber, and the wafer and the mask are also placed in a vacuum chamber.

Key concepts: Photomask, Photolithography, Lithography, Photoresist, Wafer, Extreme ultraviolet lithography, Optics, Next-generation lithography

Related papers

Back to paper searchBrowse research topicsOriginal source
Photolithography (Lithography) — Research Paper | ScholarLens