Layer Minimization of Escape Routing in Area Array Packaging
Renshen Wang, Rui Shi, Chung‐Kuan Cheng
Abstract
Renshen Wang, Rui Shi, Chung‐Kuan Cheng
Abstract
We devise a central triangular sequence to minimize the escape routing layers in area array packaging. We use a network flow model to analyze the bottleneck of the routable pins. The triangular patterns are generated in a reverse order from the last to the first layer. We demonstrate that the triangular pin sequence maximizes the sum of escape pins in the accumulated layers and thus minimize the number of escape routing layers. A test case is presented to illustrate the approach
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We devise a central triangular sequence to minimize the escape routing layers in area array packaging. We use a network flow model to analyze the bottleneck of the routable pins. The triangular patterns are generated in a reverse order from the last to the first layer. We demonstrate that the triangular pin sequence maximizes the sum of escape pins in the accumulated layers and thus minimize the number of escape routing layers. A test case is presented to illustrate the approach
Key concepts: Routing (electronic design automation), Bottleneck, Network routing, Minification, Computer science, Sequence (biology), Layer (electronics), Topology (electrical circuits)