2018Advanced Materials TechnologiesRequires access

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Abstract

In article number 1800159, Young Min Song, Jizhou Song, Kyung-In Jang, and co-workers develop a bio-integrated optoelectronic device with integration of thin metallic heat sink for interfacial thermal management. It exhibits excellent heat dissipation capabilities for thermally safe long-term usability, due to the high thermal conductivity and film-type geometrical design of the heat sink for skin applications. The architecture of the device with the metallic heat sink ensures mechanically and thermally invisible blood flow monitoring.

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What this paper is about

In article number 1800159, Young Min Song, Jizhou Song, Kyung-In Jang, and co-workers develop a bio-integrated optoelectronic device with integration of thin metallic heat sink for interfacial thermal management. It exhibits excellent heat dissipation capabilities for thermally safe long-term usability, due to the high thermal conductivity and film-type geometrical design of the heat sink for skin applications. The architecture of the device with the metallic heat sink ensures mechanically and thermally invisible blood flow monitoring.

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Available abstract

In article number 1800159, Young Min Song, Jizhou Song, Kyung-In Jang, and co-workers develop a bio-integrated optoelectronic device with integration of thin metallic heat sink for interfacial thermal management. It exhibits excellent heat dissipation capabilities for thermally safe long-term usability, due to the high thermal conductivity and film-type geometrical design of the heat sink for skin applications. The architecture of the device with the metallic heat sink ensures mechanically and thermally invisible blood flow monitoring.

Key concepts: Heat sink, Thermal management of electronic devices and systems, Materials science, Usability, Thermal conductivity, High heat, Mechanical engineering, Optoelectronics

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