2022•MRS CommunicationsOpen access

Porous 3D Cu structures with adaptive heat dissipation properties

Jean‐François Silvain, Helies Boumali, Julie Bourret, Pierre‐Marie Geffroy, Sébastien Fourcade, Thomas Batigne, Karim Sinno, Yongfeng Lu, Loïc Constantin

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Key concepts: Materials science, Porosity, Heat sink, Copper, Sintering, Thermal management of electronic devices and systems, Extrusion, Dissipation

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