ScholarLens Back to search
2021•Unpublished venueRequires access

Chip Scale and Wafer Level Packaging of LED s

S. W. Ricky Lee, Jeffery C. C. Lo, Mian Tao, Huaiyu Ye

Open publisher page 0 citations

Abstract

Most of the light emitting diode (LED) packaging processes are adopted from conventional integrated circuit packaging. An LED wafer level packaging (WLP) can be divided into two parts: silicon submount fabrication and LED packaging at the wafer level. This chapter reviews two types of advanced LED wafer level packages which utilize the technologies. The first one is a multichip package with a small form factor, while the other one has a cavity for die mounting to achieve a thin package. Chip scale packaging is one advanced packaging method in electronic packaging. The overall LED WLP process can be divided into two parts: silicon submount fabrication and the packaging process at the wafer level. The chapter discusses three case studies on LED WLP. The first two cases are “Multichip LED WLP with through Silicon Slots” and “LED WLP with a Cavity”. The remaining case is related to the application of LED WLP panels.

About this research paper

What this paper is about

Most of the light emitting diode (LED) packaging processes are adopted from conventional integrated circuit packaging. An LED wafer level packaging (WLP) can be divided into two parts: silicon submount fabrication and LED packaging at the wafer level. This chapter reviews two types of advanced LED wafer level packages which utilize the technologies. The first one is a multichip package with a small form factor, while the other one has a cavity for die mounting to achieve a thin package. Chip scale packaging is one advanced packaging method in electronic packaging. The overall LED WLP process can be divided into two parts: silicon submount fabrication and the packaging process at the wafer level. The chapter discusses three case studies on LED WLP. The first two cases are “Multichip LED WLP with through Silicon Slots” and “LED WLP with a Cavity”. The remaining case is related to the application of LED WLP panels.

Why it matters

A significance statement is not available in the OpenAlex record.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

Most of the light emitting diode (LED) packaging processes are adopted from conventional integrated circuit packaging. An LED wafer level packaging (WLP) can be divided into two parts: silicon submount fabrication and LED packaging at the wafer level. This chapter reviews two types of advanced LED wafer level packages which utilize the technologies. The first one is a multichip package with a small form factor, while the other one has a cavity for die mounting to achieve a thin package. Chip scale packaging is one advanced packaging method in electronic packaging. The overall LED WLP process can be divided into two parts: silicon submount fabrication and the packaging process at the wafer level. The chapter discusses three case studies on LED WLP. The first two cases are “Multichip LED WLP with through Silicon Slots” and “LED WLP with a Cavity”. The remaining case is related to the application of LED WLP panels.

Key concepts: Wafer-level packaging, Wafer, Wafer-scale integration, Chip-scale package, Chip, Die (integrated circuit), Light-emitting diode, Fabrication

Related papers

Related paper 1Related paper 2
Back to paper searchBrowse research topicsOriginal source
Chip Scale and Wafer Level Packaging of LED s — Research Paper | ScholarLens