2021•Unpublished venueRequires access

Research on SiP Signal Integrity Based on Ansys SIwave in Wearable Medical Systems

Zheng Yang, Yingke Gao, Shenglong Li, Chuanchuan Sun, Yunfu Zhao

Abstract

One of the main challenge for wearable medical systems is how to integrate more functional ICs in a very small space. As a kind of new packaging and system integration technology, SiP (System in Package) simplifies the system design and complies with the requirements of device miniaturization with multi-component integration. However, high layout and routing density in SiP substrate tend to cause SI (Signal Integrity) and PI (Power Integrity) issues. This paper introduces the main reasons and improvement measures for signal and power integrity issues in SiP designs. Based on ANSYS SIwave simulation platform, the simulation process of major parameters for signal and power integrity and related optimization methods are discussed in the design process of SiP.

About this research paper

What this paper is about

Why it matters

OpenAlex reports 7 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

Key concepts: System in package, Signal integrity, Power integrity, SIGNAL (programming language), Computer science, Wearable computer, Process (computing), System integration