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Signal Integrity Analysis for RF System-in-Package

Jeff Chen, Weiping Li, Feng Ling

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Abstract

RF System-in-Package (SiP) has become a viable packaging platform, which offers great flexibility to integrate ICs with different processes and different architects. With operating frequency becoming higher and multiple available technologies embedded in one package, the system could fail due to the undesired noise coupling resulted from the close proximity of the components. Therefore, the design methodology with signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis becomes essential to tackle the SiP integration issues. The paper presents a RF SiP design methodology with SI/PI/EMC simulations, which greatly reduces the design time and enables first-pass success.

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What this paper is about

RF System-in-Package (SiP) has become a viable packaging platform, which offers great flexibility to integrate ICs with different processes and different architects. With operating frequency becoming higher and multiple available technologies embedded in one package, the system could fail due to the undesired noise coupling resulted from the close proximity of the components. Therefore, the design methodology with signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis becomes essential to tackle the SiP integration issues. The paper presents a RF SiP design methodology with SI/PI/EMC simulations, which greatly reduces the design time and enables first-pass success.

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Available abstract

RF System-in-Package (SiP) has become a viable packaging platform, which offers great flexibility to integrate ICs with different processes and different architects. With operating frequency becoming higher and multiple available technologies embedded in one package, the system could fail due to the undesired noise coupling resulted from the close proximity of the components. Therefore, the design methodology with signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis becomes essential to tackle the SiP integration issues. The paper presents a RF SiP design methodology with SI/PI/EMC simulations, which greatly reduces the design time and enables first-pass success.

Key concepts: Power integrity, Signal integrity, System in package, Electromagnetic compatibility, Radio frequency, Electronic engineering, Flexibility (engineering), Computer science

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