2021•Microelectronics ReliabilityRequires access

Power cycling failure analysis of double side cooled IGBT modules for automotive applications

Yaqing Ma, Jianfeng Li, Fangfang Dong, Jun Yu

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Key concepts: Insulated-gate bipolar transistor, Power cycling, Heat sink, Power module, Temperature cycling, Junction temperature, Reliability (semiconductor), Chip

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Power cycling failure analysis of double side cooled IGBT modules for automotive applications — Research Paper | ScholarLens