2020•UTS ePRESS (University of Technology Sydney)Requires access

Analysis and Modeling of Thermal Coupling Effect Between Power Semiconductor Devices

Kaixin Wei

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Key concepts: Semiconductor, Coupling (piping), Power (physics), Semiconductor device, Electrical engineering, Materials science, Engineering physics, Engineering

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Analysis and Modeling of Thermal Coupling Effect Between Power Semiconductor Devices — Research Paper | ScholarLens