2003•Acta Scientiarum Naturalium Universitatis SunyatseniRequires access

Microstructure and Strength of the TiB2 Cermet/TiAl Joint Diffusion Bonded with Ni Interlayer

Zhuoran, Li, Jicai, Feng, Jian JIAN, 。 Cao, Yiyu, Qian Qian

Abstract

Vacuum diffusion bonding of TiB2 cermet to TiAl -based alloys using Ni interlayer has been carried out at 1123～1323 K for0.6～3.6 ks under 80 MPa. The effects of joining parameters on the microstructure of the joints and mechanical propertieswas investigated. The results showed that a TiAlNi2 intermetallic layer and two Ti, Al, Ni solid solution layers were formed atthe interface of Ni/TiAl. The shear strength was 110 MPa with bonding temperature at 1223 K, bonding time for 1.8 ks andbonding pressure under 80 MPa.

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Key concepts: Diffusion bonding, Cermet, Intermetallic, Materials science, Microstructure, Shear strength (soil), Joint (building), Metallurgy